Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push

Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push

Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract ​chip making and advanced packaging envisaged to exceed $200 billion until ‌2030.

This summary is based on reporting by MyJoyOnline Ghana.

Read the full article at MyJoyOnline Ghana

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